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Global Radiation Resistant Electronics Market (2022-2027)

Dublin, March 8, 2022 (GLOBE NEWSWIRE) – The report “Radiation Resistant Electronics Market: Global Industry Trends, Share, Size, Growth, Opportunities and Forecasts 2022-2027” has been added to by ResearchAndMarkets.com offering.

The global radiation-resistant electronics market reached a value of $ 1.3 billion in 2021. Looking ahead, the publisher expects the market to reach $ 1.6 billion by 2027, exhibiting a CAGR of 3. % in the period 2022-2027.

Bearing in mind the uncertainties of COVID-19, we continuously monitor and evaluate the direct and indirect influence of the pandemic on the different end-use sectors. This information is included in the report as a major contributor to the market.

Radiation Hardened Electronics refers to various electronic components, packages and products mainly used for high altitude applications. Materials used to manufacture these components include silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon. These components are resistant to damage caused by ionizing and high-energy radiation, and by gamma and neutron radiation emitted by nuclear reactors. They are widely used in satellites, aircraft and nuclear power plants in the form of switching regulators, microprocessors and power devices. For this reason, they find wide applications in various sectors, including aviation, space, military and defense.

The global market is primarily driven by the growing number of space missions and exploration activities. In line with this, the growing demand for communications satellites for intelligence, surveillance and reconnaissance (ISR) operations is also providing a boost to market growth. Radiation resistant electronics are critical to protecting electronic equipment from physical damage and failure caused by harmful radiation in space.

Furthermore, the widespread adoption of products for the manufacturing of power management devices is creating a positive impact on the market. This electronics is also used for manufacturing diodes, transistors and metal oxide semiconductor field effect transistors (MOSFETs) for various military and defense applications. In addition, various technological advances, such as the development of highly reliable integrated circuits and improvements in field-programmable gate array (FPGA) technology, are creating positive prospects for the market. Other factors, including significant growth in the electronics industry and extensive research and development (R&D) activities, are expected to further drive the market.

Key market segmentation:

The publisher provides an analysis of key trends in each subsegment of the global Radiation Resistant Electronics market, along with forecasts at the global, regional and national levels from 2022 to 2027. Our report ranked the market by type of product, type of material, technique, type of component and application.

Breakdown by product type:

  • Custom made
  • Commercial ready to use

Breakage by type of material:

  • Silicon
  • Silicon carbide
  • gallium nitride
  • Other

Breakdown by technique:

  • Radiation Hardening By Design (RHBD)
  • Process Hardening Radiation (RHBP)
  • Radiation Hardening by Software (RHBS)

Breakdown by component type:

  • Energy management
  • Application specific integrated circuit
  • Logic
  • Memory
  • Field programmable gate array
  • Other

Breakdown by application:

  • Space satellites
  • Commercial satellites
  • Military
  • Aerospace and Defense
  • Nuclear power plants
  • Other

Breakdown by region:

  • North America
  • United States
  • Canada
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Other
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Other
  • Latin America
  • Brazil
  • Mexico
  • Other
  • Middle East and Africa

Competitive landscape:

The report also analyzed the competitive landscape of the market with some of the major players such as Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company, Xilinx Inc., etc.

Key questions answered in this report:

  • How has the global radiation resistant electronics market performed so far and how will it behave in the coming years?
  • What are the main regional markets?
  • What has been the impact of COVID-19 on the global radiation resistant electronics market?
  • What is the break in the market based on the type of product?
  • What is the break in the market based on the type of material?
  • What is the technique-based market break?
  • What is the break in the market based on the type of component?
  • What is the market break based on the application?
  • What are the various stages of the industry value chain?
  • What are the key drivers and challenges in the industry?
  • What is the structure of the global radiation resistant electronics market and who are the key players?
  • What is the degree of competition in the sector?

Key topics covered:

1 Preface

2 Scope and methodology

3 Executive summary

4 Introduction
4.1 Overview
4.2 Key industry trends

5 Global Radiation Resistant Electronics Market
5.1 Market overview
5.2 Market trend
5.3 Impact of COVID-19
5.4 Market forecasts

6 Breakdown of the market by type of product
6.1 Made to measure
6.1.1 Market Trends
6.1.2 Market forecasts
6.2 Commercial ready to use
6.2.1 Market Trends
6.2.2 Market forecasts

7 Breakdown of the market by type of material
7.1 Silicon
7.1.1 Market Trends
7.1.2 Market forecasts
7.2 Silicon carbide
7.2.1 Market Trends
7.2.2 Market forecasts
7.3 gallium nitride
7.3.1 Market Trends
7.3.2 Market forecasts
7.4 Others
7.4.1 Market Trends
7.4.2 Market forecasts

8 Breakdown of the market by technique
8.1 Radiation Hardening by Design (RHBD)
8.1.1 Market Trends
8.1.2 Market forecasts
8.2 Radiation hardening by process (RHBP)
8.2.1 Market Trends
8.2.2 Market forecasts
8.3 Radiation hardening by software (RHBS)
8.3.1 Market Trends
8.3.2 Market forecasts

9 Breakdown of the market by type of component
9.1 Power management
9.1.1 Market Trends
9.1.2 Market forecasts
9.2 Application specific integrated circuit
9.2.1 Market Trends
9.2.2 Market forecasts
9.3 Logic
9.3.1 Market Trends
9.3.2 Market forecasts
9.4 Memory
9.4.1 Market Trends
9.4.2 Market forecasts
9.5 Field Programmable Gate Array
9.5.1 Market Trends
9.5.2 Market forecasts
9.6 Others
9.6.1 Market Trends
9.6.2 Market forecasts

10 Market breakdown by application
10.1 Space satellites
10.1.1 Market Trends
10.1.2 Market forecasts
10.2 Commercial Satellites
10.2.1 Market Trends
10.2.2 Market forecasts
10.3 Military
10.3.1 Market Trends
10.3.2 Market forecasts
10.4 Aerospace and Defense
10.4.1 Market Trends
10.4.2 Market forecasts
10.5 Nuclear power plants
10.5.1 Market Trends
10.5.2 Market forecasts
10.6 Others
10.6.1 Market Trends
10.6.2 Market forecasts

11 Breakdown of the market by region

12 SWOT Analysis

13 Value chain analysis

14 Porters five forces analysis

15 Price indicators

16 Competitive landscape
16.1 Market structure
16.2 Key players
16.3 Profiles of key players
16.3.1 Analog Devices Inc.
16.3.1.1 Company overview
16.3.1.2 Product portfolio
16.3.1.3 Financial data
16.3.1.4 SWOT Analysis
16.3.2 BAE Systems plc
16.3.2.1 Company overview
16.3.2.2 Product portfolio
16.3.2.3 Financial data
16.3.3 Cobham Plc (Advent International)
16.3.3.1 Company overview
16.3.3.2 Product portfolio
16.3.3.3 Financial data
16.3.3.4 SWOT Analysis
16.3.4 Data Device Corporation (Transdigm Group Incorporated)
16.3.4.1 Company overview
16.3.4.2 Product portfolio
16.3.5 Honeywell International Inc.
16.3.5.1 Company overview
16.3.5.2 Product portfolio
16.3.5.3 Financial data
16.3.5.4 SWOT analysis
16.3.6 Microchip Technology Inc.
16.3.6.1 Company overview
16.3.6.2 Product portfolio
16.3.6.3 Financial data
16.3.6.4 SWOT Analysis
16.3.7 STMicroelectronics
16.3.7.1 Company overview
16.3.7.2 Product portfolio
16.3.7.3 Financial data
16.3.8 Texas Instruments Incorporated
16.3.8.1 Company overview
16.3.8.2 Product portfolio
16.3.8.3 Financial data
16.3.8.4 SWOT analysis
16.3.9 The Boeing company
16.3.9.1 Company overview
16.3.9.2 Product portfolio
16.3.9.3 Financial data
16.3.9.4 SWOT Analysis
16.3.10 Xilinx Inc.
16.3.10.1 Company overview
16.3.10.2 Product portfolio
16.3.10.3 Financial data
16.3.10.4 SWOT analysis

For more information on this report, please visit https://www.researchandmarkets.com/r/2uq4qu

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