Global Electronic Adhesives Market Until 2027 - Players include 3M, BASF, and LG Chem among others

Global Electronic Adhesives Market Until 2027 – Players include 3M, BASF, and LG Chem among others

DUBLIN, April 05, 2022– (BUSINESS WIRE) – The “Global Electronic Adhesives Market Outlook to 2027” report has been added to by offering.

According to the publisher, the global Electronic Adhesives market is expected to see a significant growth rate over the forecast period.

Companies mentioned

  • Henkel AG & Co. KGaA

  • The chemical company Dow,

  • HB Fuller Company

  • The 3M company


  • Alent plc

  • KYOCERA Chemical Corporation

  • Hitachi Chemical Co. srl

  • LG Chem Ltd.

  • Indio company

  • Mitsubishi chemicals

  • Sika AG

  • Pidilite Industries Ltd.

  • Permabond LLC


Factors such as surface mount technology extensively use electronic adhesives in electronic component assembly to mount electronic parts on the top layer of the printed circuit board should drive the growth of the electronic adhesives market. Furthermore, the demand for electronic adhesives is increasing in the automotive industry due to the rapid use of electronic components in numerous automotive components.

In addition, technological innovations and advances in end-user sectors are fueling the demand for electronic adhesives, thereby increasing the growth of the electronic adhesives market. However, the significant installation costs related to product assembly, lamination and packaging of advanced machinery are hindering the development of the electronic adhesives market. The mature electronic adhesives market in developed countries and currency exchange rate fluctuations are expected to hinder market growth.

Electronic adhesives are mainly used to secure cables, bond surface mount components and encapsulate components. Electronic adhesives find applications in various end applications such as cellular and telecommunications, desktops, networks, televisions, home appliances, automotive, aerospace and defense electronics, analytical and measurement instruments, and medical equipment.

Surface mount, also called chip bonding, is the primary application of adhesives in the electronics industry. Electronic sealants are applied for both wave soldering and reflow soldering processes and these compounds have superior electrical conductivity and are easy to distribute. The method includes placing surface mount devices on beads or spots of UV curing adhesives and curing the adhesive to hold the device firmly and firmly in the required place during further processing of the produced electronic equipment. Surface mount adhesives serve as processing aids as the mounting fixtures are permanently bonded by soldering and provide stress relief to soldering parts to prevent electrical connection failures.

The properties of electronic adhesives required for surface mounting are long life, non-tightening, fast hardening, high strength and good flexibility and electrical properties after hardening. Single component systems are preferred for these applications to avoid air trapping, viscosity changes and pot life. The function of these electronic adhesives also varies depending on the application and can be electrically conductive or electrically non-conductive and thermally conductive. Increasing research into the development of high performance adhesives for mounting miniature devices in the electronics industry is estimated to boost market growth during the forecast period.

Asia Pacific accounted for the highest share of the market and is likely to continue to dominate the electronic adhesives market during the projected period. The growing demand for safety, comfort, stability and high performance features is driving the need for electrification in automobiles, powering electronic adhesives. In addition to semiconductor applications in the automotive industry, thermally conductive adhesives are the most popular in automotive electronics, where they are used for etching and thermal management. Emerging trends in light electronic products and vehicles are increasing the demand for cyanoacrylate electronic adhesives.

Advances in complex automobile design with various lightweight substrates and innovative self-adhesive labels and packaging are expected to drive the need for more cost-effective application systems. Technological progress, coupled with the implementation of safety standards for electronic applications, is expected to soon drive the development of the electronic adhesives market. The performance of new solid-state semiconductor technologies in industrial and consumer applications is likely to accelerate market expansion. Companies are investing more in the use of microelectronic devices in niche applications. This should stimulate the growth of the electronic adhesives market.

Key topics covered:

1. Executive summary

2. Scope and methodology of the research

3. Market analysis

4. Analysis of the sector

5. Market segmentation and forecasting

6. Analysis of the regional market

7. Key company profiles

8. Competitive landscape

9. Conclusions and Recommendations

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